News By MOLEX

赫聯電子將亮相2017深圳國際電子展

專業的互連與機電產品授權分銷商赫聯電子將亮相2017深圳國際電子展ELEXCON(12月21日- 12月23日)。屆時赫聯電子將聯同TE Connec...

Molex Introduces the USB Smart Modules

Molex has merged automotive-grade durability with mass availability on its ...

Molex Introduces the Micro-Fit 3.0 Connector System Product Family

Molex’s Micro-Fit 3.0 Connector Systems, available in multiple circuit size...

Molex’s New Single-Row Gold-Plated Pico-Clasp Wire-to-Board Connectors

Molex has introduced gold-plated Pico-Clasp Wire-to-Board Connectors in sin...

Molex Introduced Debuts zSFP+ Interconnect System for 56 Gbps Channels

Molex has expanded its zSFP+ Interconnect Systemto support 56 Gbps PAM-4 ch...

Molex Taiwan Presents Heilind Asia with APS Regional Distributor of the Year 2016

Heilind Asia Pacific, part of Heilind Electronics Inc., has been awarded th...

赫聯電子與您相約2017台北國際電腦展COMPUTEX

專業的互連與機電產品授權分銷商赫聯電子將再次亮相2017台北國際電腦展COMPUTEX(5月30日- 6月3日),屆時赫聯同TE Connectivi...

Heilind Asia Will Exhibit at Hall E, BK2-01 in CommunicAsia from 23 to 25 May

CommunicAsia is a 3 day event being held from 23 May to the 25 May 2017 at ...

Heilind Asia Will Exhibit at B46 in Mumbai LED Expo from 11 – 13 May

The 16th edition of LED Expo which is to be held from 11 – 13 May 2017, at ...

Molex Introduces the Nano-Fit™ Power Connectors to the Market

Molex introduces its new year first product - Nano-Fit™ Power Connectors to...


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